Effect of tensile stress during crack healing on the remaining strength of silicon nitride ceramics at high temperatures

Hiroyuki Waki, Tomohiko Hojo

研究成果: Article査読

抄録

Crack healing by high temperature oxidation in fine ceramics is an effective method to overcome their low toughness. The crack healing behavior of conventional Si3N4 was examined. The healing temperature chosen for this study was 1100°C, a temperature at which cracks were imperfectly healed. The effect of stress during crack healing was experimentally investigated based on the strength of the imperfectly healed crack. The primary focus of this study was on the investigation of healing behavior during a tensile stress, under which the oxidization of cracks was accelerated and the Si3N4 oxidized significantly because of opened cracks. The following results were obtained: (1) Healing without stress successfully enhanced both remaining strength and apparent fracture toughness of the cracked specimen at room temperature and temperatures as high as 1000°C. (2) The remaining strength when healing in air was higher than that when healing in a low pressure atmosphere. However, the difference in remaining strength between the two was relatively small. (3) The remaining strength when healing with compressive stress was as well as that without stress. (4) Both remaining strength and apparent fracture toughness of the healed specimen, with tensile healing, hardly increased. It was also concluded that the amount of oxidation did not significantly affect the healing behavior in this study.

本文言語English
ページ(範囲)456-461
ページ数6
ジャーナルZairyo/Journal of the Society of Materials Science, Japan
64
6
DOI
出版ステータスPublished - 2015 6 1
外部発表はい

ASJC Scopus subject areas

  • 材料科学(全般)
  • 凝縮系物理学
  • 材料力学
  • 機械工学

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