TY - JOUR
T1 - Effect of prior cold working before aging on the precipitation behavior in a Cu-3.5 wt% Ti alloy
AU - Jo, Minah
AU - Choi, Eun Ae
AU - Ahn, Jee Hyuk
AU - Son, Young Guk
AU - Kim, Kwangho
AU - Lee, Jehyun
AU - Semboshi, Satoshi
AU - Han, Seung Zeon
N1 - Funding Information:
This work was supported principally by Global Frontier R&D Program (2013M3A6B1078874) on Global Frontier Hybrid Interface Materials R&D Center funded by the Ministry of Science, ICT, Future Planning and the National Research Foundation of Korea (NRF) grant funded by the Korea government (MSIP) [No. 2018R1A5A6075959], and the Fundamental Research Program (POC2910) of the Korean Institute of Materials Science (KIMS).
Publisher Copyright:
© The Korean Institute of Metals and Materials
PY - 2019
Y1 - 2019
N2 - Cu-Ti alloys were strengthened by Cu 4 Ti intermetallic compound precipitation in a Cu matrix during aging. The Cu-3.5 wt% Ti(Cu-4.6 at% Ti) alloys without deformation and with uniform and nonuniform deformation were aged at 450 o C for various times after solution treatment at 885 o C. The uniformly and non-uniformly deformed alloys show slip and shear band formation in the matrix, respectively. The deformation bands, slip or shear bands, were still maintained even after 12 hours of aging at 450 o C. The conductivity of all the specimens continuously increased, but the hardness reached the peak value and then decreased during aging. The hardness and conductivity of the specimen with shear bands had a higher value than the specimens without deformation and with slip bands. Additionally, the time to reach peak hardness of the specimen with shear bands was shortened to 30 minutes compared to 720 and 1440 minutes for specimens with slip bands and without deformation bands, respectively. The highest combination value of conductivity and hardness, 16.8% IACS and 302 Hv, was obtained in the specimen with shear bands after aging for 360 minutes.
AB - Cu-Ti alloys were strengthened by Cu 4 Ti intermetallic compound precipitation in a Cu matrix during aging. The Cu-3.5 wt% Ti(Cu-4.6 at% Ti) alloys without deformation and with uniform and nonuniform deformation were aged at 450 o C for various times after solution treatment at 885 o C. The uniformly and non-uniformly deformed alloys show slip and shear band formation in the matrix, respectively. The deformation bands, slip or shear bands, were still maintained even after 12 hours of aging at 450 o C. The conductivity of all the specimens continuously increased, but the hardness reached the peak value and then decreased during aging. The hardness and conductivity of the specimen with shear bands had a higher value than the specimens without deformation and with slip bands. Additionally, the time to reach peak hardness of the specimen with shear bands was shortened to 30 minutes compared to 720 and 1440 minutes for specimens with slip bands and without deformation bands, respectively. The highest combination value of conductivity and hardness, 16.8% IACS and 302 Hv, was obtained in the specimen with shear bands after aging for 360 minutes.
KW - Aging
KW - Cu Ti intermetallic compound
KW - Cu-Ti alloy
KW - Electrical conductivity
KW - Precipitation hardening
UR - http://www.scopus.com/inward/record.url?scp=85062811738&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85062811738&partnerID=8YFLogxK
U2 - 10.3365/KJMM.2019.57.1.10
DO - 10.3365/KJMM.2019.57.1.10
M3 - Article
AN - SCOPUS:85062811738
SN - 1738-8228
VL - 57
SP - 10
EP - 17
JO - Journal of Korean Institute of Metals and Materials
JF - Journal of Korean Institute of Metals and Materials
IS - 1
ER -