TY - GEN
T1 - Effect of molecular structure of scavengers on copper diffusion deterrence in low k film
AU - Nomura, Yutaka
AU - Ryuzaki, Daisuke
AU - Koyanagi, Mitsumasa
PY - 2006/12/1
Y1 - 2006/12/1
N2 - Low k material with high deterrence ability of copper diffusion has been proposed to reduce the effective electrical resistance of copper wirings. Providing organic low k material with deterrence ability was attempted by adding a chemical agent that chemically combines with copper. The insulation lifetime of the low k film with benzotriazole (BTA) as the copper scavenger was about two orders of magnitude higher than that of BTA-free low k film, at the practical electric field strength of 0.1 MV/cm. The copper diffusion deterrence ability was clearly dependent on the ability of the copper scavenger.
AB - Low k material with high deterrence ability of copper diffusion has been proposed to reduce the effective electrical resistance of copper wirings. Providing organic low k material with deterrence ability was attempted by adding a chemical agent that chemically combines with copper. The insulation lifetime of the low k film with benzotriazole (BTA) as the copper scavenger was about two orders of magnitude higher than that of BTA-free low k film, at the practical electric field strength of 0.1 MV/cm. The copper diffusion deterrence ability was clearly dependent on the ability of the copper scavenger.
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M3 - Conference contribution
AN - SCOPUS:40949160598
SN - 9781604234053
T3 - Materials Research Society Symposium Proceedings
SP - 50
EP - 55
BT - Smart Dielectric Polymer Properties, Characterization and Their Devices
T2 - 2006 MRS Fall Meeting
Y2 - 27 November 2006 through 29 November 2006
ER -