Effect of line-shape on threshold current density of electromigration damage in bamboo lines

Kazuhiko Sasagawa, Shigeo Uno, Nao Yamaji, Masumi Saka

研究成果: Conference contribution

抜粋

It is known that there is the threshold current density of the electromigration damage in the via-connected line. The evaluation of the threshold current density is one of the great interests from the viewpoint of IC reliability. In this study, a metal line with two-dimensional shape, i.e. an angled metal line is treated. The evaluation method of the threshold current density is applied to the metal line. The method is based on the numerical simulation of the building-up process of the atomic density distribution in the bamboo line by using the governing parameter for electromigration damage. Comparing the evaluated results with that of straight-shaped line, the effect of line-shape on threshold current density of electromigration damage is discussed. Furthermore, the obtained difference in the threshold current density is verified experimentally.

元の言語English
ホスト出版物のタイトルProceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems
ホスト出版物のサブタイトルAdvances in Electronic Packaging 2005
出版者American Society of Mechanical Engineers
ページ1147-1152
ページ数6
ISBN(印刷物)0791842002, 9780791842003
DOI
出版物ステータスPublished - 2005 1 1
イベントASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005 - San Francisco, CA, United States
継続期間: 2005 7 172005 7 22

出版物シリーズ

名前Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005
PART B

Other

OtherASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005
United States
San Francisco, CA
期間05/7/1705/7/22

ASJC Scopus subject areas

  • Engineering(all)

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  • これを引用

    Sasagawa, K., Uno, S., Yamaji, N., & Saka, M. (2005). Effect of line-shape on threshold current density of electromigration damage in bamboo lines. : Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005 (pp. 1147-1152). (Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005; 巻数 PART B). American Society of Mechanical Engineers. https://doi.org/10.1115/ipack2005-73133