Effect of chip size and thermal amplitude on fatigue life of Pb-free solder bump

Shoho Ishikawa, Hironori Tohmyoh, Masumi Saka, Satoshi Watanabe, Motohisa Kuroha, Yoshikatsu Nakano

研究成果: Conference contribution

1 被引用数 (Scopus)

抄録

Due to environmental concerns, Pb-free solders are widely used in electronic industry for assembling electronic components on the substrate. Under the various operation conditions, solder bumps are subjected to cyclic stress and failed by fatigue. To ensure the reliability of electronic products, it is becoming important to predict the fatigue failure of the Pb-free solder bumps. In this study, effects of chip size and thermal amplitude on fatigue life of the Pb-free solder bumps were investigated by experiments and elastic-plastic finite element analysis. A parameter, which is valuable to compare the fatigue damage of electronic packages with different chip size, is introduced.

本文言語English
ホスト出版物のタイトルASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011
ページ207-211
ページ数5
DOI
出版ステータスPublished - 2011 12月 1
イベントASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011 - Portland, OR, United States
継続期間: 2011 7月 62011 7月 8

出版物シリーズ

名前ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011
1

Other

OtherASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011
国/地域United States
CityPortland, OR
Period11/7/611/7/8

ASJC Scopus subject areas

  • 電子工学および電気工学

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