The effect of strong carbide forming elements (Ti, Zr) in the Cu matrix on interfacial bonding and electric conductivity of CNF/Cu composites has been studied. The chemical bonding states of C/Cu interfaces were calculated by using the first-principles molecular orbital method, which showed that the presence of Ti or Zr in the interface layer strongly increases chemical bonding strength across the interface. The CNF/Cu composites with the alloying elements have been fabricated successfully by liquid infiltration process. Tensile strength of composites with additional element has been increased. However, Ti addition compared with Zr addition resulted in great loss of electric conductivity.
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