A new technique for high resolution lithography with a dry-developed multilayer resist system is demonstrated. The technique involves a direct pattern fabrication by electron beam-induced vapor-phase graft-polymerization. No wet process was included in the pattern fabrication. The use of a double-layer base film consisting of a thin silicone resin as a top layer and a thick AZ-1350J film as a bottom layer enabled the transfer of graft-polymerized polystyrene patterns on the silicone resin to thick resist with submicron-sized feature.
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