Development of wiring boards using single-layer adsorption films and their recycle method

Yuji Suzuki, Masaru Nakagawa, Tomokazu Iyoda

研究成果: Paper査読

抄録

We developed a novel method for recycling wiring polymer boards using a layer-by-layer multilayer of colloidal SiO2 particles as a separation layer on a PET substrate. A plating-promotion layer of poly(4-vinyl pyridine-co-1-dodecyl-4-vinylpyridinium bromide)(QP4VP) was adsorbed on the colloidal SiO2 multilayer and patterned by vacuum ultraviolet light irradiation through a photomask. Selective Cu deposition occurred in accordance with the QP4VP photopattern shape and Cu wiring boards could be prepared. The Cu wiring boards were separated readily due to dissolving SiO2 particle by an alkali NaOH solution. It was found that the colloidal SiO2 multilayer was available for the separation layer of wiring boards.

本文言語English
ページ数1
出版ステータスPublished - 2005 12 1
外部発表はい
イベント54th SPSJ Annual Meeting 2005 - Yokohama, Japan
継続期間: 2005 5 252005 5 27

Other

Other54th SPSJ Annual Meeting 2005
国/地域Japan
CityYokohama
Period05/5/2505/5/27

ASJC Scopus subject areas

  • 工学(全般)

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