Development of thermodynamic database for micro-soldering alloys

I. Ohnuma, X. J. Liu, H. Ohtani, K. Anzai, R. Kainuma, K. Ishida

研究成果: Conference contribution

4 被引用数 (Scopus)


Recent progress on the database of calculated phase diagrams in micro-soldering alloy systems, which consist of Pb, Bi, Sn, Sb, Cu, Ag, In and Zn, is presented. Experimental determination of phase equilibria was conducted in several binary, ternary and quaternary systems by DSC, EDX and X-ray diffraction techniques. Based on these experiments, as well as on previous data on phase diagrams and thermo-chemical properties such as activity, heat of mixing and enthalpy of formation, the various thermodynamic parameters for describing the Gibbs energies of the different constituent phases were optimized and evaluated by the CALPHAD (calculation of phase diagrams) method. The database provides key information on liquidus and solidus surfaces, isothermal and vertical section diagrams, and mole fractions of the phase constitutions of multi-component soldering alloys. Thermodynamic properties of the surface tension and viscosity of the liquid phase can also be predicted. Moreover, a nonequilibrium solidification process using the Scheil model was simulated. Several phase diagrams of Pb-bearing and Pb-free solders are presented. The database is expected to be a powerful tool and an indispensable resource for the development of new Pb-free solders.

ホスト出版物のタイトルProceedings of 3rd Electronics Packaging Technology Conference, EPTC 2000
編集者Charles Lee, Kok Chuan Toh, Thiam Beng Lim
出版社Institute of Electrical and Electronics Engineers Inc.
出版ステータスPublished - 2000
イベント3rd Electronics Packaging Technology Conference, EPTC 2000 - Singapore, Singapore
継続期間: 2000 12 52000 12 7


名前Proceedings of the Electronic Packaging Technology Conference, EPTC


Other3rd Electronics Packaging Technology Conference, EPTC 2000

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics

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