Development of materials design tool and its application in Pb-free micro-solders in electronic package

Xingjun Liu, Cuiping Wang, Ikuo Ohnuma, Shuanglin Chen, Ryosuke Kainuma, Kiyohito Ishida, Austin Y. Chang

研究成果: Article査読

1 被引用数 (Scopus)

抄録

A materials design tool for developing Pb-free soldering alloys in electronic package was developed based on comprehensive experimental data of phase equilibria and thermodynamic properties data accumulated with the CALPHAD (calculation of phase diagrams) method and contains 10 elements, namely, Ag, Au, Bi, Cu, In, Ni, Sb, Sn, Zn and Pb. It can handle the calculation of phase diagrams in all combinations of these elements and all composition ranges. In addition, based on this tool, the liquidus, solidus, phase fractions and constitutions, equilibrium and non-equilibrium solidification behavior, surface tension and viscosity of liquid, diffusion reactions and microstructural evolution, etc. can be predicted. Typical examples of the calculation and application of this tool are presented. The design tool is expected to be a powerful tool for the development of Pb-free solders, as well as for promoting the understanding of the interfacial phenomena between Cu substrate and Pb-free solders in electronic packaging technology.

本文言語English
ページ(範囲)1495-1500
ページ数6
ジャーナルScience China Technological Sciences
53
6
DOI
出版ステータスPublished - 2010 6

ASJC Scopus subject areas

  • 材料科学(全般)
  • 工学(全般)

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