Development of highly-reliable microbump bonding technology using self-assembly of NCF-covered KGDs and multi-layer 3D stacking challenges

Yuka Ito, Mariappan Murugesan, Hisashi Kino, Takafumi Fukushima, Kang Wook Lee, Koji Choki, Tetsu Tanaka, Mitsumasa Koyanagi

研究成果: Conference contribution

15 被引用数 (Scopus)

抄録

We have proposed a new multichip-to-wafer 3D stacking method with high throughput and high yield based on a capillary self-assembly method using liquid droplets. In this paper, we optimized conditions in self-assembly and microbump bonding using non-conductive film (NCF)-covered known good dies (KGDs). Self-assembly of the NCF-covered KGDs provided high chip alignment accuracy within approximately 1 μm. After the self-assembly and a subsequent thermal compression, resultant microbump chains composed of over 7,000 microbump joints exhibited good electrical properties of 32 mω/joint without bridge short and open failures. The microbump joint resistance varied within 5% of the initial values after thermal cycle test (TCT) of 1,000 cycles. In addition, we demonstrated a multi-layer 3D stacking by the self-assembly method with the NCF-covered KGDs.

本文言語English
ホスト出版物のタイトル2015 IEEE 65th Electronic Components and Technology Conference, ECTC 2015
出版社Institute of Electrical and Electronics Engineers Inc.
ページ336-341
ページ数6
ISBN(電子版)9781479986095
DOI
出版ステータスPublished - 2015 7月 15
イベント2015 65th IEEE Electronic Components and Technology Conference, ECTC 2015 - San Diego, United States
継続期間: 2015 5月 262015 5月 29

出版物シリーズ

名前Proceedings - Electronic Components and Technology Conference
2015-July
ISSN(印刷版)0569-5503

Other

Other2015 65th IEEE Electronic Components and Technology Conference, ECTC 2015
国/地域United States
CitySan Diego
Period15/5/2615/5/29

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 電子工学および電気工学

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