Development of Ag3Sn intermetallic compound joint for power semiconductor devices

Toshihide Takahashi, Shuichi Komatsu, Tatsuoki Kono

研究成果: Article査読

8 被引用数 (Scopus)

抄録

Pb-based solders are used as high temperature solders in power semiconductor devices. Although use of Pb is globally restricted, alternative materials are inadequate to replace Pb-based solder. This study aims to replace Pb-based solder with an intermetallic compound (IMC). Samples were produced to join a Si chip with evaporated Ag and Sn films onto a Ag-plated Cu substrate at 523 K for 10 s. As a result, the evaporated films were completely transformed into a Ag3Sn IMC. The IMC joint showed higher strength until 543 K and good heat-aging resistance at 423 K. Therefore, this joint would be promising in replacing Pb-based solders.

本文言語English
ジャーナルElectrochemical and Solid-State Letters
12
7
DOI
出版ステータスPublished - 2009 8 28
外部発表はい

ASJC Scopus subject areas

  • 化学工学(全般)
  • 材料科学(全般)
  • 物理化学および理論化学
  • 電気化学
  • 電子工学および電気工学

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