Development of a new self-assembled die bonder to three-dimensionally stack known good dies in batch

Takafumi Fukushima, Eiji Iwata, Tetsu Tanaka, Mitsumasa Koyanagi

研究成果: Conference contribution

抄録

We developed a new self-assembled die bonder to produce three-dimensionally integrated circuit (3D IC) using a multichip-to-wafer bonding method in batch. In the self-assembled multichip bonder, large number of known good dies (KGDs) can be simultaneously transferred to an LSI wafer on which hydrophilic bonding areas with liquid droplets are prepared. The many KGD can be aligned to the bonding areas by the liquid surface tension. The average alignment accuracy was found to be approximately 400 nm and the total alignment time was less than 0.1 sec. After liquid evaporation, the many KGDs can be bonded to the bonding areas in the new self-assembled die bonder.

本文言語English
ホスト出版物のタイトル2009 IEEE International Conference on 3D System Integration, 3DIC 2009
DOI
出版ステータスPublished - 2009 12 1
イベント2009 IEEE International Conference on 3D System Integration, 3DIC 2009 - San Francisco, CA, United States
継続期間: 2009 9 282009 9 30

出版物シリーズ

名前2009 IEEE International Conference on 3D System Integration, 3DIC 2009

Other

Other2009 IEEE International Conference on 3D System Integration, 3DIC 2009
国/地域United States
CitySan Francisco, CA
Period09/9/2809/9/30

ASJC Scopus subject areas

  • ハードウェアとアーキテクチャ
  • 電子工学および電気工学

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