Copper/Carbon composites are now considered as very good candidates to act as efficient heat sinks in power electronics. However, reliability of the whole device still depends on the characteristics of the links between each components of a microelectronic device. This work presents an alternative route to report DBC on a Cu/C heat sink using a thin metallic film deposited by an electrodeposition process.
|出版ステータス||Published - 2009 12 1|
|イベント||17th International Conference on Composite Materials, ICCM-17 - Edinburgh, United Kingdom|
継続期間: 2009 7 27 → 2009 7 31
|Other||17th International Conference on Composite Materials, ICCM-17|
|Period||09/7/27 → 09/7/31|
ASJC Scopus subject areas
- Ceramics and Composites