Development and characterization of novel metallic joint in power electronic device

Guillaume Lacombe, Jean Marc Heintz, Akira Kawasaki, Jean François Silvain

研究成果: Paper査読

抄録

Copper/Carbon composites are now considered as very good candidates to act as efficient heat sinks in power electronics. However, reliability of the whole device still depends on the characteristics of the links between each components of a microelectronic device. This work presents an alternative route to report DBC on a Cu/C heat sink using a thin metallic film deposited by an electrodeposition process.

本文言語English
出版ステータスPublished - 2009 12 1
イベント17th International Conference on Composite Materials, ICCM-17 - Edinburgh, United Kingdom
継続期間: 2009 7 272009 7 31

Other

Other17th International Conference on Composite Materials, ICCM-17
CountryUnited Kingdom
CityEdinburgh
Period09/7/2709/7/31

ASJC Scopus subject areas

  • Engineering(all)
  • Ceramics and Composites

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