Design and experiment of thermal contact sensor detecting defects on Si wafer surface

Wenjian Lu, Yuki Shimizu, So Ito, Wei Gao

研究成果: Conference contribution

2 被引用数 (Scopus)

抄録

A design study of a thermal-type contact sensor for the detection of small defects, the heights of which are less than 16 nm on wafer surfaces, is described in this paper. The feasibility of the contact sensor, which would detect frictional heat generated at the contact with defects, was theoretically investigated focusing on the temperature rise of the sensor element. To investigate the temperature rise of the contact sensor due to the generated frictional heat, both the theoretical calculation with a simple model of heat transfer and a simulation with a finite element model (FEM) were carried out. Relationship between the sensor size and the response of the temperature rise of the contact sensor was also investigated by using FEM simulation.

本文言語English
ホスト出版物のタイトルEmerging Technology in Precision Engineering XIV
出版社Trans Tech Publications Ltd
ページ826-831
ページ数6
ISBN(印刷版)9783037855096
DOI
出版ステータスPublished - 2012
イベント14th International Conference on Precision Engineering, ICPE 2012 - Hyogo, Japan
継続期間: 2012 11 82012 11 10

出版物シリーズ

名前Key Engineering Materials
523-524
ISSN(印刷版)1013-9826
ISSN(電子版)1662-9795

Other

Other14th International Conference on Precision Engineering, ICPE 2012
CountryJapan
CityHyogo
Period12/11/812/11/10

ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

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