Design and Application of Innovative Multi-table and Bond Head Drive System on Thermal Compression Bonder with UPH over 2000

Kohei Seyama, Shoji Wada, Yuji Eguchi, Tomonori Nakamura, Doug Day, Shigetoshi Sugawa

研究成果: Conference contribution

4 引用 (Scopus)

抜粋

A new, highly productive and accurate thermal compression bonder is presented. Overcoming the disparity between productivity and accuracy, we propose a multi-table and multi-bond head system utilizing gantries, including: a pipeline system to decrease total cooling time during TCB, a cancellation system for vibration during table motion, and a structure for high force bonding with accuracy appropriate for TCB. On a system containing 2 bond heads on 2 gantries, the total TCB process time applying the proposed pipeline system is decreased to 5.5sec, which is 33% higher productivity compared to series processing. By using a structure of separating the bonder base and moving axis, which functions as a cancellation system for vibration generated from the moving axis, no vibration propagates to the other moving axis, resulting that the system enables high speed operation to improve productivity. Typical systems which mount bonding heads on a gantry are constructed with a cantilever structure having advantages for the structure and light weight while having disadvantages for shifting placement position during high force bonding over 100N. To satisfy both placement accuracy and high force for TCB, a new system is designed which transfers high Z axis force to a separate upper structure, solving the inherent accuracy problems with cantilever systems. At 200N, the placement shifts are 1μm with the system and 12μm without it. By implementing the described functions, a productive and accurate TCB bonder is realized. In this paper, we report detailed experimental results for the functions. The potential of a new TCB bonder including these new functions will be demonstrated through bonding results.

元の言語English
ホスト出版物のタイトルProceedings - IEEE 68th Electronic Components and Technology Conference, ECTC 2018
出版者Institute of Electrical and Electronics Engineers Inc.
ページ392-400
ページ数9
ISBN(印刷物)9781538649985
DOI
出版物ステータスPublished - 2018 8 7
イベント68th IEEE Electronic Components and Technology Conference, ECTC 2018 - San Diego, United States
継続期間: 2018 5 292018 6 1

出版物シリーズ

名前Proceedings - Electronic Components and Technology Conference
2018-May
ISSN(印刷物)0569-5503

Other

Other68th IEEE Electronic Components and Technology Conference, ECTC 2018
United States
San Diego
期間18/5/2918/6/1

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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  • これを引用

    Seyama, K., Wada, S., Eguchi, Y., Nakamura, T., Day, D., & Sugawa, S. (2018). Design and Application of Innovative Multi-table and Bond Head Drive System on Thermal Compression Bonder with UPH over 2000. : Proceedings - IEEE 68th Electronic Components and Technology Conference, ECTC 2018 (pp. 392-400). [8429579] (Proceedings - Electronic Components and Technology Conference; 巻数 2018-May). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ECTC.2018.00066