Cu oxide has been deoxidized in an extremely low oxygen partial pressure atmosphere. The oxygen was evacuated to 10-28 atm using a newly developed oxygen reduction system (ORS). It was experimentally demonstrated that the surface oxide of Cu film was completely removed by exposure to such an environment at 200°C. The proposed deoxidization reaction can be used as a new Cu surface cleaning technique.
|ジャーナル||Japanese Journal of Applied Physics, Part 2: Letters|
|出版物ステータス||Published - 2006 5 17|
ASJC Scopus subject areas
- Physics and Astronomy (miscellaneous)
- Physics and Astronomy(all)