抄録
This work represents an investigation concerning densification kinetics during microwave sintering of copper powder using single-mode and multimode applicators operating at 2.45 GHz. Analysis of densification kinetics was made using densification parameter. Heating stage for sintering using single-mode applicator was found to be of great importance. While both processes have the same nature of heating, sintering kinetics in single-mode applicator were shown to be faster comparing to those for multimode ones. Partial melting of matter during sintering in single-mode applicator may be considered as an explanation.
本文言語 | English |
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ページ(範囲) | 1433-1436 |
ページ数 | 4 |
ジャーナル | Materials Letters |
巻 | 64 |
号 | 13 |
DOI | |
出版ステータス | Published - 2010 7月 15 |
外部発表 | はい |
ASJC Scopus subject areas
- 材料科学(全般)
- 凝縮系物理学
- 材料力学
- 機械工学