抄録
The functional split-gate type trigate flash memory cell transistors have successfully been fabricated for the first time, and their threshold voltage (V t) variations before and after nor-mode program/erase cycle have systematically been compared with the stack-gate ones. It was experimentally found that split-gate type cell transistors with the same control gate length (L CG) of 176 nm show much smaller V t distribution after erase compared to those of stack-gate ones. Moreover, the measured source-drain breakdown voltage (BV DS) is higher than 3.1 V even the L CG was down to 76 nm. This indicates that the developed split-gate type trigate flash memory is very effective for scaled nor-type flash memory with highly suppressed over-erase.
本文言語 | English |
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論文番号 | 6145732 |
ページ(範囲) | 345-347 |
ページ数 | 3 |
ジャーナル | IEEE Electron Device Letters |
巻 | 33 |
号 | 3 |
DOI | |
出版ステータス | Published - 2012 3月 |
外部発表 | はい |
ASJC Scopus subject areas
- 電子材料、光学材料、および磁性材料
- 電子工学および電気工学