Deformation of varifocal mirror with narrow frame by SOI wafer residual stress

Takashi Sasaki, Kazuhiro Hane

研究成果: Article査読

4 被引用数 (Scopus)

抄録

Silicon-on-insulator (SOI) wafers are used for many micro-electro- mechanical systems (MEMS). The influences of residual stress of SOI wafer on the fabricated structures are important especially for micro-mirror because the optical performances are often affected by them. In this study, we propose an analytical calculation for the deformation of mirror and frame of a varifocal mirror. The deformations of the fabricated structures were measured using a white light interferometer. The frame was tilted at 2.8 mrad which was explained by the calculated value of 3.9 mrad. The mirror was deflected by 100 nm with the top-flat shape, which also agreed well with the proposed analysis.

本文言語English
ページ(範囲)26-33
ページ数8
ジャーナルElectronics and Communications in Japan
95
8
DOI
出版ステータスPublished - 2012 8 1

ASJC Scopus subject areas

  • 信号処理
  • 物理学および天文学(全般)
  • コンピュータ ネットワークおよび通信
  • 応用数学
  • 電子工学および電気工学

フィンガープリント

「Deformation of varifocal mirror with narrow frame by SOI wafer residual stress」の研究トピックを掘り下げます。これらがまとまってユニークなフィンガープリントを構成します。

引用スタイル