Deep through silicon via in laser-ablated CMOS multi-project wafer for surface-mountable integrated MEMS

Yukio Suzuki, Hideki Hirano, Masanori Muroyama, Shuji Tanaka

研究成果: Conference contribution

本文言語English
ホスト出版物のタイトルSmart Systems Integration 2019 - International Conference and Exhibition on Integration Issues of Miniaturized Systems, SSI 2019
編集者Thomas Otto
出版社VDE Verlag GmbH
ページ177-180
ページ数4
ISBN(電子版)9783800748785
出版ステータスPublished - 2019
イベント13th Smart Systems Integration Conference, SSI 2019 - Barcelona, Spain
継続期間: 2019 4 102019 4 11

出版物シリーズ

名前Smart Systems Integration 2019 - International Conference and Exhibition on Integration Issues of Miniaturized Systems, SSI 2019

Conference

Conference13th Smart Systems Integration Conference, SSI 2019
CountrySpain
CityBarcelona
Period19/4/1019/4/11

ASJC Scopus subject areas

  • Artificial Intelligence
  • Computer Networks and Communications
  • Computer Science Applications

引用スタイル