Debris-free laser dicing for multi-layered MEMS

Masayuki Fujita, Yusaku Izawa, Yosuke Tsurumi, Shuji Tanaka, Hideyuki Fukushi, Keiichi Sueda, Yoshiki Nakata, Noriaki Miyanaga, Masayoshi Esashi

研究成果: Paper査読

抄録

We have developed a novel debris-free in-air laser dicing technology, which gives more design freedoms in the structure, process and materials of multi-layered MEMS as well as improves yields [1]. Our technology combines two processes: dicing guide fabrication and wafer separation process. The first process is the internal transformation using a fundamental wavelength of a Nd:YVO4 laser or a Nd:YAG laser. The second process is non-contact separation by thermally-induced crack propagation using a CO2 laser or mechanical separation by bending stress. The internal transformation fabricated in the first process worked well as the guide for the separation. The diced lines completely followed the pre-fabricated internal transformation.

本文言語English
ページ6-10
ページ数5
出版ステータスPublished - 2008 12 1
イベントICALEO 2008 - 27th International Congress on Applications of Lasers and Electro-Optics - Temecula, CA, United States
継続期間: 2008 10 202008 10 23

Other

OtherICALEO 2008 - 27th International Congress on Applications of Lasers and Electro-Optics
国/地域United States
CityTemecula, CA
Period08/10/2008/10/23

ASJC Scopus subject areas

  • 電子工学および電気工学
  • 電子材料、光学材料、および磁性材料

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