TY - GEN
T1 - Damage-free post-CMP cleaning solution for low-k fluorocarbon on advanced interconnects
AU - Gu, Xun
AU - Nemoto, Takenao
AU - Teramoto, Akinobu
AU - Hasebe, Rui
AU - Ito, Takashi
AU - Ohmi, Tadahiro
N1 - Copyright:
Copyright 2015 Elsevier B.V., All rights reserved.
PY - 2009
Y1 - 2009
N2 - As technology node progressing, ultra low-k film has been implemented to reduce RC delay in LSI circuit. A fluorocarbon (CFx) film is proposed as foreground ultra low-k film because of non-porous structure [1]. Although CFx film is expected to be stable for its structure advantage, damage-less process is anticipated to avoid dielectric constants change in subsequence process steps [2]. CMP and post CMP process are concerned to bring damage on devices, so the effect of post CMP cleaning solutions on CFx structure and electric property is evaluated.
AB - As technology node progressing, ultra low-k film has been implemented to reduce RC delay in LSI circuit. A fluorocarbon (CFx) film is proposed as foreground ultra low-k film because of non-porous structure [1]. Although CFx film is expected to be stable for its structure advantage, damage-less process is anticipated to avoid dielectric constants change in subsequence process steps [2]. CMP and post CMP process are concerned to bring damage on devices, so the effect of post CMP cleaning solutions on CFx structure and electric property is evaluated.
KW - Damage-free
KW - Dielectric constant
KW - Fluorocarbon
KW - Post CMP cleaning solution
KW - XPS
UR - http://www.scopus.com/inward/record.url?scp=75849151161&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=75849151161&partnerID=8YFLogxK
U2 - 10.4028/www.scientific.net/SSP.145-146.381
DO - 10.4028/www.scientific.net/SSP.145-146.381
M3 - Conference contribution
AN - SCOPUS:75849151161
SN - 3908451647
SN - 9783908451648
T3 - Solid State Phenomena
SP - 381
EP - 384
BT - Ultra Clean Processing of Semiconductor Surfaces IX
PB - Trans Tech Publications Ltd
T2 - 9th international symposium on Ultra Clean Processing of Semiconductor Surfaces, UCPSS 2008
Y2 - 22 September 2008 through 24 September 2008
ER -