Cyanide-free displacement silver plating using highly concentrated aqueous solutions of metal chloride salts

Ken Adachi, Atushi Kitada, Kazuhiro Fukami, Kuniaki Murase

研究成果: Article査読

5 被引用数 (Scopus)

抄録

We report a novel, cyanide-free, and low-cost displacement silver (Ag) plating bath, i.e., AgCl-dissolved highly concentrated CaCl2/LiCl aqueous solution. Compared to dilute CaCl2/LiCl solutions, this aqueous solution exhibited much higher AgCl solubility because of the high activity of Cl; the maximum AgCl solubility was achieved at 44.4 mmol dm–3 (i.e., [Ag(I)] = 8.07 g kg−1 H2O). Smooth Ag deposits with a lusterless gray-colored appearance were successfully obtained by displacement plating on a Cu substrate. The mechanism of smooth Ag plating is discussed in terms of its electrochemical and diffusive properties.

本文言語English
ページ(範囲)D409-D414
ジャーナルJournal of the Electrochemical Society
166
10
DOI
出版ステータスPublished - 2019

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Renewable Energy, Sustainability and the Environment
  • Surfaces, Coatings and Films
  • Electrochemistry
  • Materials Chemistry

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