TY - GEN
T1 - Current and future 3D-LSI technology for image sensor devices
AU - Motoyoshi, Makoto
AU - Nakamura, Hirofumi
AU - Bonkohara, Manabu
AU - Koyanagi, Mitsumasa
N1 - Copyright:
Copyright 2009 Elsevier B.V., All rights reserved.
PY - 2009
Y1 - 2009
N2 - Recently the development of three-dimensional large-scale integration (3D-LSI) has been accelerated and its stage has changed from the research level or limited production level to the investigation level with a perspective on mass production. This paper describes the current and future 3D-LSI technologies including Through Silicon Vias (TSVs) focused on image sensor application. Using the current technologies, the chip size packages (CSPs) for 1.3M, 2M, and 5M pixel CMOS image sensors are successfully fabricated without performance degradation. One of many potential applications for 3D-LSI is the high performance focal plane array image sensors. We propose the high-speed image sensor with 100% optical fill factor by using next generation 3D-LSI technology with micro-bumps and micro-TSVs.
AB - Recently the development of three-dimensional large-scale integration (3D-LSI) has been accelerated and its stage has changed from the research level or limited production level to the investigation level with a perspective on mass production. This paper describes the current and future 3D-LSI technologies including Through Silicon Vias (TSVs) focused on image sensor application. Using the current technologies, the chip size packages (CSPs) for 1.3M, 2M, and 5M pixel CMOS image sensors are successfully fabricated without performance degradation. One of many potential applications for 3D-LSI is the high performance focal plane array image sensors. We propose the high-speed image sensor with 100% optical fill factor by using next generation 3D-LSI technology with micro-bumps and micro-TSVs.
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M3 - Conference contribution
AN - SCOPUS:70449572699
SN - 9781605110844
T3 - Materials Research Society Symposium Proceedings
SP - 25
EP - 32
BT - Materials Research Society Symposium Proceedings - Materials and Technologies for 3-D Integration
T2 - Materials and Technologies for 3-D Integration - 2008 MRS Fall Meeting
Y2 - 1 December 2008 through 3 December 2008
ER -