Crystallographic effect on subsurface damage formation in silicon microcutting

Jiwang Yan, Tooru Asami, Hirofumi Harada, Tsunemoto Kuriyagawa

研究成果: Article査読

91 被引用数 (Scopus)

抄録

Nanoprecision plunge cutting tests were carried out on single-crystal silicon (0 0 1) samples along various directions at different tool rake angles, and subsurface damage was characterized by cross-sectional transmission electron microscopy and laser micro-Raman spectroscopy. It was found that amorphization, poly-crystallization, dislocation and internal microcracking occurred and these material responses depended strongly on the cutting direction. When cutting in the 11̄0 and 01̄0 directions, deep line defects consisting of microcracks and dislocation groups occurred even when the surface was "ductile"-cut; while for the 1283090 direction, the damage depth was reduced by a factor of five.

本文言語English
ページ(範囲)131-134
ページ数4
ジャーナルCIRP Annals - Manufacturing Technology
61
1
DOI
出版ステータスPublished - 2012

ASJC Scopus subject areas

  • 機械工学
  • 産業および生産工学

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