Crystal structure and grain formation mechanism of bismuth–indium particles generated by ultrasonic irradiation

Akio Furusawa, Kiyohiro Hine, Hidetoshi Kitaura, Yamato Hayashi, Hirotsugu Takizawa

研究成果: Article査読

抄録

The miniaturization and high functionalization of electronic devices are driving the micronization of electronic components. In order to effectively microjoin electronic components, it is necessary to micronize the particles used in the soldering paste. In this study, we utilized an ultrasonic irradiation method to produce fine metal particles, and examined the influence of ultrasonic irradiation on the solidification process of the soldering materials. Bismuth–indium (Bi–45wt.%In) solder melted in a high-boiling-point solvent was exposed to ultrasonic irradiation to form droplets. By irradiating these droplets with ultrasonic waves during solidification, the amount of BiIn2 in the solid solder composition increased, while that of Bi3In5 decreased. In addition, submicron-sized agglomerations consisting of numerous small particles (~ 30 nm in diameter) were detected in the solvent; the In content of these clusters was ≥ 70 wt.%. It is thought that the amount of Bi3In5 generated decreased due to cavitation during solid–liquid phase coexistence, which caused the liquid-phase components with high In concentrations to separate from the droplets.

本文言語English
ページ(範囲)10998-11008
ページ数11
ジャーナルJournal of Materials Science
54
16
DOI
出版ステータスPublished - 2019 8 30

ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

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