Cryogenic dry etching for high aspect ratio microstructures

Kenji Murakami, Yuji Wakabayashi, Kazuyuki Minami, Masayoshi Esashi

研究成果: Conference contribution

33 引用 (Scopus)

抜粋

Cryogenic reactive ion etching (RIE) has been studied to fabricate microstructures. Cryogenic system has cathode stage of which temperature is controlled from 0 to -140°C. The magnetic field and narrow gap between electrodes are introduced to increase plasma density. The etching behavior of silicon and polyimide film (KAPTON H film) has been investigated using this system. By using this cryogenic RIE system, directional etching was achieved at low temperature. The etch rate was increased using Sm-Co permanent magnets and also with high flow rate of the etching gas under the constant pressure condition. In the case of silicon wafer etching, maximum etch rate of 1.6μm/min was achieved with normalized side etch of less than 0.02 at cathode temperature of -120°C. Etching selectivity (the etch rate of the silicon wafer / the etch rate of the mask material) was over 900 at the power density of less than 4.0W/cm2. In the case of the polyimide film etching, normalize side etch of less than 0.01 with the etch rate of 0.8μm/min was achieved at -100°C. The cryogenic RIE system can be used to fabricate 3-dimensional silicon and polyimide structures with high aspect ratio.

元の言語English
ホスト出版物のタイトルIEEE Micro Electro Mechanical Systems
出版者Publ by IEEE
ページ65-70
ページ数6
ISBN(印刷物)0780309588
出版物ステータスPublished - 1993 1 1
イベントProceedings of the 1993 IEEE Micro Electro Mechanical Systems - MEMS - Fort Lauderdale, FL, USA
継続期間: 1993 2 71993 2 10

出版物シリーズ

名前IEEE Micro Electro Mechanical Systems

Other

OtherProceedings of the 1993 IEEE Micro Electro Mechanical Systems - MEMS
Fort Lauderdale, FL, USA
期間93/2/793/2/10

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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  • これを引用

    Murakami, K., Wakabayashi, Y., Minami, K., & Esashi, M. (1993). Cryogenic dry etching for high aspect ratio microstructures. : IEEE Micro Electro Mechanical Systems (pp. 65-70). (IEEE Micro Electro Mechanical Systems). Publ by IEEE.