Copper balls interconnection technology for 60 GHz band 3-D system-in-package modules

Satoshi Yoshida; Shoichi Tanifuji; Suguru Kameda; Noriharu Suematsu; Tadashi Takagi; Kazuo Tsubouchi

Copper balls interconnection technology for 60 GHz band 3-D system-in-package modules

Satoshi Yoshida, Shoichi Tanifuji, Suguru Kameda, Noriharu Suematsu, Tadashi Takagi, Kazuo Tsubouchi

電気通信研究所・ブロードバンド工学研究部門

研究成果: Conference contribution

9 被引用数 (Scopus)

抄録

In this paper, we propose a novel copper balls interconnection technology for 60 GHz band 3-D system-in-package (SiP) modules for 10mm square 60 GHz band ultra-small wireless personal area network (WPAN) using organic substrates. Copper ball diameter of 350 μm is used for interconnection between the substrates. Ground copper balls placement is discussed showing electric field distribution. As a result, six ground copper balls around vertical signal line interconnection part are crucial for improvement of transmission characteristics. The six ground copper balls interconnection structure have similar results up to about 70GHz for S₂₁ compared with through CPW, hence copper balls interconnection technology is usable up to about 70 GHz.

本文言語	English
ホスト出版物のタイトル	2010 Asia-Pacific Microwave Conference Proceedings, APMC 2010
ページ	904-907
ページ数	4
出版ステータス	Published - 2010 12月 1
イベント	2010 Asia-Pacific Microwave Conference, APMC 2010 - Yokohama, Japan 継続期間: 2010 12月 7 → 2010 12月 10

Other

Other	2010 Asia-Pacific Microwave Conference, APMC 2010
国/地域	Japan
City	Yokohama
Period	10/12/7 → 10/12/10

ASJC Scopus subject areas

電子工学および電気工学

他のファイルとリンク

引用スタイル

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title = "Copper balls interconnection technology for 60 GHz band 3-D system-in-package modules",

abstract = "In this paper, we propose a novel copper balls interconnection technology for 60 GHz band 3-D system-in-package (SiP) modules for 10mm square 60 GHz band ultra-small wireless personal area network (WPAN) using organic substrates. Copper ball diameter of 350 μm is used for interconnection between the substrates. Ground copper balls placement is discussed showing electric field distribution. As a result, six ground copper balls around vertical signal line interconnection part are crucial for improvement of transmission characteristics. The six ground copper balls interconnection structure have similar results up to about 70GHz for S21 compared with through CPW, hence copper balls interconnection technology is usable up to about 70 GHz.",

keywords = "60 GHz, millimeter-wave, small terminal, system-in-package, WPAN",

author = "Satoshi Yoshida and Shoichi Tanifuji and Suguru Kameda and Noriharu Suematsu and Tadashi Takagi and Kazuo Tsubouchi",

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T1 - Copper balls interconnection technology for 60 GHz band 3-D system-in-package modules

AU - Yoshida, Satoshi

AU - Tanifuji, Shoichi

AU - Kameda, Suguru

AU - Suematsu, Noriharu

AU - Takagi, Tadashi

AU - Tsubouchi, Kazuo

PY - 2010/12/1

Y1 - 2010/12/1

N2 - In this paper, we propose a novel copper balls interconnection technology for 60 GHz band 3-D system-in-package (SiP) modules for 10mm square 60 GHz band ultra-small wireless personal area network (WPAN) using organic substrates. Copper ball diameter of 350 μm is used for interconnection between the substrates. Ground copper balls placement is discussed showing electric field distribution. As a result, six ground copper balls around vertical signal line interconnection part are crucial for improvement of transmission characteristics. The six ground copper balls interconnection structure have similar results up to about 70GHz for S21 compared with through CPW, hence copper balls interconnection technology is usable up to about 70 GHz.

AB - In this paper, we propose a novel copper balls interconnection technology for 60 GHz band 3-D system-in-package (SiP) modules for 10mm square 60 GHz band ultra-small wireless personal area network (WPAN) using organic substrates. Copper ball diameter of 350 μm is used for interconnection between the substrates. Ground copper balls placement is discussed showing electric field distribution. As a result, six ground copper balls around vertical signal line interconnection part are crucial for improvement of transmission characteristics. The six ground copper balls interconnection structure have similar results up to about 70GHz for S21 compared with through CPW, hence copper balls interconnection technology is usable up to about 70 GHz.

KW - 60 GHz

KW - millimeter-wave

KW - small terminal

KW - system-in-package

KW - WPAN

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BT - 2010 Asia-Pacific Microwave Conference Proceedings, APMC 2010

T2 - 2010 Asia-Pacific Microwave Conference, APMC 2010

Y2 - 7 December 2010 through 10 December 2010

ER -

Copper balls interconnection technology for 60 GHz band 3-D system-in-package modules

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