Copper balls interconnection technology for 60 GHz band 3-D system-in-package modules

Satoshi Yoshida, Shoichi Tanifuji, Suguru Kameda, Noriharu Suematsu, Tadashi Takagi, Kazuo Tsubouchi

研究成果: Conference contribution

9 被引用数 (Scopus)

抄録

In this paper, we propose a novel copper balls interconnection technology for 60 GHz band 3-D system-in-package (SiP) modules for 10mm square 60 GHz band ultra-small wireless personal area network (WPAN) using organic substrates. Copper ball diameter of 350 μm is used for interconnection between the substrates. Ground copper balls placement is discussed showing electric field distribution. As a result, six ground copper balls around vertical signal line interconnection part are crucial for improvement of transmission characteristics. The six ground copper balls interconnection structure have similar results up to about 70GHz for S21 compared with through CPW, hence copper balls interconnection technology is usable up to about 70 GHz.

本文言語English
ホスト出版物のタイトル2010 Asia-Pacific Microwave Conference Proceedings, APMC 2010
ページ904-907
ページ数4
出版ステータスPublished - 2010 12月 1
イベント2010 Asia-Pacific Microwave Conference, APMC 2010 - Yokohama, Japan
継続期間: 2010 12月 72010 12月 10

Other

Other2010 Asia-Pacific Microwave Conference, APMC 2010
国/地域Japan
CityYokohama
Period10/12/710/12/10

ASJC Scopus subject areas

  • 電子工学および電気工学

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