Cooling performance of compact heat sinks with semimicrochannels

Taku Ohara, Toshio Aihara, Chihiro Hayashi

研究成果: Conference contribution

7 被引用数 (Scopus)

抄録

A highly compact heat sink has been developed for forced air cooling of LSI packages and heat dissipation and pressure drop performance of the heat sink have been experimentally studied. These heat sinks have a remarkable feature of extremely narrow fin spacing, and hence, large heat-transfer area per unit heat-sink volume. The streamwise fin length was designed to be short to prevent an excessive pressure drop of the air flow. The cooling performance of these heat sinks in forced air flow was measured carefully and compared with that of a typical heat sink commercially used for the cooling of LSI packages. It is shown that the new-type heat sinks have highly improved performance in regard to compactness.

本文言語English
ホスト出版物のタイトルAmerican Society of Mechanical Engineers, EEP
出版社Publ by ASME
ページ249-252
ページ数4
ISBN(印刷版)0791807665
出版ステータスPublished - 1992 12 1
イベントProceedings of the 1992 Joint ASME/JSME Conference on Electronic Packaging. Part 2 (of 2) - Milpitas, CA, USA
継続期間: 1992 4 91992 4 12

出版物シリーズ

名前American Society of Mechanical Engineers, EEP
1

Other

OtherProceedings of the 1992 Joint ASME/JSME Conference on Electronic Packaging. Part 2 (of 2)
CityMilpitas, CA, USA
Period92/4/992/4/12

ASJC Scopus subject areas

  • 電子工学および電気工学
  • 機械工学

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