Comprehensive study on wafer-level vacuum packaging using anodically-bondable LTCC wafer and thin film getter

Shuji Tanaka, Hideyuki Fukushi

研究成果: Conference contribution

4 被引用数 (Scopus)

抄録

An anodically-bondable low-temperature cofired ceramic (LTCC) wafer is a new wafer-level packaging material for micro electro mechanical systems (MEMS). It provides 3-dimensional metal interconnection inside, and enables hermetic sealing, which was guaranteed by automobile-grade thermal cycling tests. In this study, the sealing pressure was first investigated under various anodic bonding conditions with and without two types of thin film getter (PaGe getter, Saes Getters or Ti getter). The vacuum sealing pressure was a few kPa or even higher, and more importantly, often different for each sample without the thin film getter. On the other hand, samples with the getter always exhibited good vacuum level, which was below the detection limit (80 Pa) of zero-balance method using a Si diaphragm. Typical process conditions for borosilicate glass on commercially-available bonding tools work well.

本文言語English
ホスト出版物のタイトル2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015
出版社Institute of Electrical and Electronics Engineers Inc.
ページ468-471
ページ数4
ISBN(電子版)9781479989553
DOI
出版ステータスPublished - 2015 8月 5
イベント18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015 - Anchorage, United States
継続期間: 2015 6月 212015 6月 25

出版物シリーズ

名前2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015

Other

Other18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015
国/地域United States
CityAnchorage
Period15/6/2115/6/25

ASJC Scopus subject areas

  • 器械工学
  • 電子工学および電気工学

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