Compact and high rigidity structure of slit type wire bonder ultrasonic transducer

Kohei Seyama, Osamu Kakutani, Shigetoshi Sugawa

研究成果: Article査読

抄録

Ultrasonic Transducer in the wire bonding machine is a key component to determine its bonding speed, and is demanded to be downsized with keeping high rigidity performance for high-speed bonding process. In this paper, a modeling of the ultrasonic transducer vibration and a new ultrasonic transducer with slit structure near the fixation parts is discussed. The piezoelectric element designed by an analytical model has 45% lighter weight than the conventional one. The slit type ultrasonic transducer newly proposed and simulation by finite element method has 66% lighter weight and 2.44-times higher rigidity than the conventional one. As a result, the slit type ultrasonic transducer enable 200G acceleration motion at Z direction of wire bonder from 160G by previous one and it shorten 33% of rising ultrasonic vibration time. Finally, it makes 17% faster cycle time to make wire, it has a potential to improve productivity a lot.

本文言語English
ページ(範囲)176-181
ページ数6
ジャーナルSeimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering
85
2
DOI
出版ステータスPublished - 2019 1 1

ASJC Scopus subject areas

  • 機械工学

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