Comb-drive XYZ-microstage based on assembling technology for low temperature measurement systems

研究成果: Conference contribution

3 引用 (Scopus)

抜粋

This paper reports the novel design, fabrication and testing of a chip-level-assembled comb-drive XYZ-microstage that produces large displacements into X-, Y-, and Z-directions for the three-dimensional scanning stage of magnetic resonance force microscopy. The main parts of the XYZ-microstage, consisting of a comb-drive XY-microstage, two comb-drive Z-microstages and a bottom silicon base substrate, are assembled together by using micro manipulators. Mechanical springs are used to realize the electrical connections between the XY-microstage and the Z-microstages. It is demonstrated that the assembled XYZ-microstage can achieve large displacements of 25.2 μm in X direction, 20.4 μm in Y direction and 58.5 μm in Z direction. Also, the fabricated Z-microstage integrated with capacitive displacement sensors is installed into a vacuum chamber equipped with a liquid nitrogen cooling stage to evaluate the actuation performance at low temperatures. A maximum displacement of ∼60 μm without any degradation is obtained in the Z-microstage at 77.6 K.

元の言語English
ホスト出版物のタイトルICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference
出版者Institute of Electrical and Electronics Engineers Inc.
ページ83-88
ページ数6
ISBN(電子版)9784904090138
DOI
出版物ステータスPublished - 2015 5 20
イベント2015 International Conference on Electronic Packaging and iMAPS All Asia Conference, ICEP-IAAC 2015 - Kyoto, Japan
継続期間: 2015 4 142015 4 17

出版物シリーズ

名前ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference

Other

Other2015 International Conference on Electronic Packaging and iMAPS All Asia Conference, ICEP-IAAC 2015
Japan
Kyoto
期間15/4/1415/4/17

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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  • これを引用

    Xue, G., Toda, M., & Ono, T. (2015). Comb-drive XYZ-microstage based on assembling technology for low temperature measurement systems. : ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (pp. 83-88). [7111006] (ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICEP-IAAC.2015.7111006