Chip-interleaved multi-rate CDMA with 2-dimensional OVSF spreading

研究成果: Conference contribution

4 被引用数 (Scopus)

抄録

Chip interleaving technique has been proposed for DS-CDMA to eliminate the multiple-access interference (MAI). In this paper, we develop this technique to provide the single- or multicarrier CDMA with flexible low-to-high bit rate transmission by jointly using 2-dimensional (2D) OVSF spreading and chip interleaving for quasi-synchronous uplink transmissions in time- and frequency-selective fading channels. Through appropriate design of 2D spreading code assignment, not only the maximum time- and frequency-domain diversity can be achieved but also users are equipped with multi-rate services. The complexity of receivers is greatly reduced since single-user frequency-domain equalization (FDE) based on the MMSE criterion can be applied for signal detection. Computer simulation results show that the multi-rate transmission is possible for the 2D OVSF spread/chip-interleaved CDMA uplink and the bit error rate (BER) performance with turbo coding is very robust against Doppler spread.

本文言語English
ホスト出版物のタイトル2006 IEEE 63rd Vehicular Technology Conference, VTC 2006-Spring - Proceedings
ページ1767-1771
ページ数5
4
出版ステータスPublished - 2006 12 1
イベント2006 IEEE 63rd Vehicular Technology Conference, VTC 2006-Spring - Melbourne, Australia
継続期間: 2006 5 72006 7 10

Other

Other2006 IEEE 63rd Vehicular Technology Conference, VTC 2006-Spring
CountryAustralia
CityMelbourne
Period06/5/706/7/10

ASJC Scopus subject areas

  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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