Characterization of nanoscopic Cu/diamond interfaces prepared by surface-activated bonding: Implications for thermal management

Jianbo Liang, Yutaka Ohno, Yuichiro Yamashita, Yasuo Shimizu, Shinji Kanda, Naoto Kamiuchi, Seongwoo Kim, Koyama Koji, Yasuyoshi Nagai, Makoto Kasu, Naoteru Shigekawa

研究成果: Article査読

1 被引用数 (Scopus)

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Engineering & Materials Science

Chemical Compounds