Challenges of high-robustness self-assembly with Cu/Sn-Ag microbump bonding for die-to-wafer 3D integration

Taku SuZuki, Kazushi Asami, Yasuhiro Kitamura, Takafumi Fukushima, Chisato Nagai, Jichoel Bea, Yutaka Sato, Mariappan Murugesan, Kang Wook Lee, Mitsumasa Koyanagi

研究成果: Conference contribution

10 被引用数 (Scopus)

抄録

We demonstrated surface tension-driven self-assembly of chips with Cu/Sn-Ag microbumps in order to satisfy requirements for both high throughput and high alignment accuracy toward 3D system integration. The chips were singulated with different dicing methods: standard single-cut, precise single-cut, and modified step-cut. The alignment accuracies were compared among the three methods. The chips obtained by modified step-cut were precisely aligned within approximately 2 μm and comparable to that obtained by precise single-cut. By optimizing liquid volumes, the step-cut chips having Cu/Sn-Ag microbumps were accurately self-assembled irrespective of microbump densities. The self-assembled chips were successfully bonded at 280°C by thermal compression. The Cu/Sn-Ag daisy chains indicated good electrical characteristics with a resistance of 35 mω/joint.

本文言語English
ホスト出版物のタイトル2015 IEEE 65th Electronic Components and Technology Conference, ECTC 2015
出版社Institute of Electrical and Electronics Engineers Inc.
ページ342-347
ページ数6
ISBN(電子版)9781479986095
DOI
出版ステータスPublished - 2015 7月 15
イベント2015 65th IEEE Electronic Components and Technology Conference, ECTC 2015 - San Diego, United States
継続期間: 2015 5月 262015 5月 29

出版物シリーズ

名前Proceedings - Electronic Components and Technology Conference
2015-July
ISSN(印刷版)0569-5503

Other

Other2015 65th IEEE Electronic Components and Technology Conference, ECTC 2015
国/地域United States
CitySan Diego
Period15/5/2615/5/29

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 電子工学および電気工学

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