By an improved drying method

Masato Ohtsu, Kazuyuki Minami, Masayoshi Esashi

研究成果: Paper査読

13 被引用数 (Scopus)

抄録

Fabrication of a silicon thin beam structure bonded to a glass with a very narrow gap is needed to make highly sensitive sensors. In fabrication process of the thin beam structure, rinsing and drying process using Fluorinert, which indicates small surface tension, has been investigated to reduce stiction and collapse. Drying after rinsing in ethyl ether and Fluorinert successively was found effective to keep the silicon wafer surface clean. With this method, glass could be bonded to the silicon wafer and packaged thin beam structures were obtained. The narrow achieved gap between silicon thin (1.2 μm) beam and bonded glass was 0.7 μm. Owing to the improvement of the wafer holder and the interferometric thickness measurement, silicon thin beam of 0.27 μm in thickness was achieved.

本文言語English
ページ228-233
ページ数6
出版ステータスPublished - 1996 1月 1
イベントProceedings of the 1995 9th Annual International Workshop on Micro Electro Mechanical Systems - San Diego, CA, USA
継続期間: 1996 2月 111996 2月 15

Other

OtherProceedings of the 1995 9th Annual International Workshop on Micro Electro Mechanical Systems
CitySan Diego, CA, USA
Period96/2/1196/2/15

ASJC Scopus subject areas

  • 制御およびシステム工学
  • 機械工学
  • 電子工学および電気工学

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