TY - GEN
T1 - Boxcar averaging based scanning nonlinear dielectric microscopy and its application to carrier distribution Imaging on 2D Semiconductors
AU - Yamasue, Kohei
AU - Cho, Yasuo
N1 - Funding Information:
We would like to thank Toshihiko Iwai, Tohoku University, for providing support in the development of high-sensitivity probes. This work is partly supported by a Grant-in-Aid for Scientific Research (16H02330) from the Japan Society for the Promotion of Science.
Publisher Copyright:
© 2019 IEEE.
PY - 2019/10
Y1 - 2019/10
N2 - Intermittent contact scanning nonlinear dielectric microscopy (IC-SNDM) has recently been applied to the nanoscale carrier or active dopant distribution imaging on two-dimensional semiconductors. However, IC-SNDM may suffer from a lower signal-To-noise (S/N) ratio than conventional contact mode SNDM due to the unoptimized detection of the signal only intermittently occurring. Here we show that S/N ratio can be much improved by applying the idea of boxcar averaging, which makes anomalous carrier doping on atomically-Thin MoS2 clearly visible by IC-SNDM.
AB - Intermittent contact scanning nonlinear dielectric microscopy (IC-SNDM) has recently been applied to the nanoscale carrier or active dopant distribution imaging on two-dimensional semiconductors. However, IC-SNDM may suffer from a lower signal-To-noise (S/N) ratio than conventional contact mode SNDM due to the unoptimized detection of the signal only intermittently occurring. Here we show that S/N ratio can be much improved by applying the idea of boxcar averaging, which makes anomalous carrier doping on atomically-Thin MoS2 clearly visible by IC-SNDM.
KW - MoS
KW - Scanning nonlinear dielectric microscopy (SNDM)
KW - Two-dimensional semiconductors
UR - http://www.scopus.com/inward/record.url?scp=85080062749&partnerID=8YFLogxK
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U2 - 10.1109/IIRW47491.2019.8989887
DO - 10.1109/IIRW47491.2019.8989887
M3 - Conference contribution
AN - SCOPUS:85080062749
T3 - IEEE International Integrated Reliability Workshop Final Report
BT - 2019 IEEE International Integrated Reliability Workshop, IIRW 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2019 IEEE International Integrated Reliability Workshop, IIRW 2019
Y2 - 13 October 2019 through 17 October 2019
ER -