Body centered cubic buffer layers for enhanced lateral grain growth of Co/Cu multilayers

Masakiyo Tsunoda, Daisuke Takahashi, Migaku Takahashi

研究成果: Article査読

3 被引用数 (Scopus)

抄録

The effect of body centered cubic (bcc) solid solution buffer layers (BL) on metallurgical microstructure was investigated for enhanced lateral grain growth of Co/Cu multilayers. A guiding principle for the material research for BLs was deduced to realize flat interfaces with large lateral grain size in multilayers. It was stated that the difference between the surface energy of BL and the interfacial energy should agree with the surface energy of the layer first deposited on the BL.

本文言語English
ページ(範囲)6513-6515
ページ数3
ジャーナルJournal of Applied Physics
93
10 2
DOI
出版ステータスPublished - 2003 5 15

ASJC Scopus subject areas

  • Physics and Astronomy(all)

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