AUSN solder vacuum packaging using melted solder floodgates and laser-activated non-evaporable getters for SIC diaphragm anticorrosive vacuum sensors

Shuji Tanaka, Yutaka Honjoya, Masayoshi Esashi

研究成果: Conference contribution

9 被引用数 (Scopus)

抄録

Versatile wafer-level vacuum packaging technology using screen-printed AuSn eutectic solder was developed and applied to a SiC diaphragm anticorrosive vacuum sensor. Thin film Ti/SiO2 "floodgates" were used to prevent melted AuSn solder from flowing into microstructures, e.g. capacitive gaps. After vacuum packaging, a non-evaporable getter (NEG), which chemically absorbs residual gas, was activated by Nd:YAG laser. In comparison to other wafer-level vacuum packaging technologies, the developed one establishes electrical connections and feedthroughs simultaneously, and is tolerant to surface roughness, surface contamination and wafer waviness.

本文言語English
ホスト出版物のタイトルMEMS 2010 - The 23rd IEEE International Conference on Micro Electro Mechanical Systems, Technical Digest
ページ492-495
ページ数4
DOI
出版ステータスPublished - 2010
イベント23rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2010 - Hong Kong, China
継続期間: 2010 1 242010 1 28

出版物シリーズ

名前Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN(印刷版)1084-6999

Other

Other23rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2010
CountryChina
CityHong Kong
Period10/1/2410/1/28

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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