Atomically flat gate insulator/silicon (100) interface formation introducing high mobility, ultra-low noise, and small characteristics variation CMOSFET

R. Kuroda, Akinobu Teramoto, T. Suwa, R. Hasebe, X. Li, M. Konda, S. Sugawa, T. Ohmi

研究成果: Conference contribution

9 被引用数 (Scopus)

抄録

Atomically flat silicon surface constructed with atomic terraces and steps is realized by pure argon ambience annealing at 1200°C on (100) crystal orientation large diameter wafers with precisely controlled tilt angle. Only the radical reaction based insulator formation technology such as oxidation utilizing oxygen radicals carried out at low temperature (400°C)can preserve the atomically flatness at the gate insulator film/silicon interface. CMOSFET having the atomically flat interface exhibit extremely lower 1/f noise and higher mobility characteristics with smaller electrical variation than those of CMOSFETs fabricated by the conventional technologies.

本文言語English
ホスト出版物のタイトルESSDERC 2008 - Proceedings of the 38th European Solid-State Device Research Conference
出版社IEEE Computer Society
ページ83-86
ページ数4
ISBN(印刷版)9781424423644
DOI
出版ステータスPublished - 2008
イベントESSDERC 2008 - 38th European Solid-State Device Research Conference - Edinburgh, Scotland, United Kingdom
継続期間: 2008 9月 152008 9月 19

出版物シリーズ

名前ESSDERC 2008 - Proceedings of the 38th European Solid-State Device Research Conference

Other

OtherESSDERC 2008 - 38th European Solid-State Device Research Conference
国/地域United Kingdom
CityEdinburgh, Scotland
Period08/9/1508/9/19

ASJC Scopus subject areas

  • ハードウェアとアーキテクチャ
  • 電子工学および電気工学

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