Assembling technique of three dimensional microstructures using clip mechanism of microspring

Kyosuke Kotani, Yusuke Kawai, Chuan Yu Shao, Takahito Ono

研究成果: Conference contribution

1 被引用数 (Scopus)

抄録

In this paper, a microassembling technique of microstructures using a silicon clip mechanism is developed for a time-of-flight scanning force microscope (TOF-SFM) probe. Microsprings formed by deep reactive ion etching were used as a clip micromechnism. Microelements are manipulated by a manipulator, and microgap between the microspring and opposite wall is expanded by pulling the microspring using a microneedle. Then the microelement is inserted into the micromechnism, and clipped by releasing the microspring. After assembling, all microelements are fixed with conductive glue. This technique is advantageous to fabricate complex three-dimensional microstructures. We demonstrate the assembling of a microelectrode and microcantilever for TOF-SFM probe.

本文言語English
ホスト出版物のタイトル2011 IEEE 24th International Conference on Micro Electro Mechanical Systems, MEMS 2011
ページ209-212
ページ数4
DOI
出版ステータスPublished - 2011 4 13
イベント24th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2011 - Cancun, Mexico
継続期間: 2011 1 232011 1 27

出版物シリーズ

名前Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN(印刷版)1084-6999

Other

Other24th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2011
国/地域Mexico
CityCancun
Period11/1/2311/1/27

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 凝縮系物理学
  • 機械工学
  • 電子工学および電気工学

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