TY - GEN
T1 - Application oriented MEMS by open collaboration
AU - Esashi, Masayoshi
PY - 2008
Y1 - 2008
N2 - Silicon MEMS as electrostatically levitated rotational gyroscope and 2D optical scanner, and wafer level packaged devices as integrated capacitive pressure sensor and MEMS swatch are described. MEMS which use non-silicon materials as diamond, CNT (carbon nano tube), LTCC with electrical feedthrough, SiC (silicon carbide) and LiNbO3 for multi-probe data storage, multi-column electron beam lithography system, probe card for wafer-level burn-in test, mold for glass press molding and SAW wireless passive sensor respectively are also described.
AB - Silicon MEMS as electrostatically levitated rotational gyroscope and 2D optical scanner, and wafer level packaged devices as integrated capacitive pressure sensor and MEMS swatch are described. MEMS which use non-silicon materials as diamond, CNT (carbon nano tube), LTCC with electrical feedthrough, SiC (silicon carbide) and LiNbO3 for multi-probe data storage, multi-column electron beam lithography system, probe card for wafer-level burn-in test, mold for glass press molding and SAW wireless passive sensor respectively are also described.
UR - http://www.scopus.com/inward/record.url?scp=60649104889&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=60649104889&partnerID=8YFLogxK
U2 - 10.1109/ICSICT.2008.4735114
DO - 10.1109/ICSICT.2008.4735114
M3 - Conference contribution
AN - SCOPUS:60649104889
SN - 9781424421855
T3 - International Conference on Solid-State and Integrated Circuits Technology Proceedings, ICSICT
SP - 7
EP - 12
BT - ICSICT 2008 - 2008 9th International Conference on Solid-State and Integrated-Circuit Technology Proceedings
T2 - 2008 9th International Conference on Solid-State and Integrated-Circuit Technology, ICSICT 2008
Y2 - 20 October 2008 through 23 October 2008
ER -