Analysis of stress induced voiding using by finite element analysis coupled with finite difference analysis

Haruhisa Shigeyama, A. Toshimitsu Yokobori, Toshihito Ohmi, Takenao Nemoto

    研究成果: Conference contribution

    1 被引用数 (Scopus)

    抄録

    In this paper, the vacancy migration in Cu interconnect of large scale integration caused by stress induced voiding was calculated using the α multiplication method. Then, the effect of weight coefficient, α, on stress induced vacancy diffusion analysis was investigated and the validity of the α multiplication method was verified. Furthermore, the method of the vacancy diffusion analysis coupled with thermal stress analysis which can consider the history of thermal stress due to temperature changes was proposed. The results of the vacancy diffusion analysis coupled with the thermal stress analysis were compared with the analytical results of the vacancy migration without the effect of history of thermal stress. As a result, the maximum site of vacancy accumulation was found to be qualitatively in good agreement between them. However, the quantitative value of maximum vacancy concentration obtained by the vacancy diffusion analysis coupled with thermal stress analysis was found to be much higher and the vacancy distribution is found to be much more localized.

    本文言語English
    ホスト出版物のタイトルDiffusion in Solids and Liquids VII
    ホスト出版物のサブタイトルSolids and Liquids, Mass Transfer - Heat Transfer - Microstructure and Properties - Nanodiffusion and Nanostructured Materials
    出版社Trans Tech Publications Ltd
    ページ632-640
    ページ数9
    326-328
    ISBN(印刷版)9783037854006
    DOI
    出版ステータスPublished - 2012
    イベント7th International Conference on Diffusion in Solids and Liquids, Mass Transfer - Heat Transfer - Microstructure and Properties - Nanodiffusion and Nanostructured Materials, DSL 2011 - Algarve, Portugal
    継続期間: 2011 6 262011 6 30

    Other

    Other7th International Conference on Diffusion in Solids and Liquids, Mass Transfer - Heat Transfer - Microstructure and Properties - Nanodiffusion and Nanostructured Materials, DSL 2011
    CountryPortugal
    CityAlgarve
    Period11/6/2611/6/30

    ASJC Scopus subject areas

    • Radiation
    • Materials Science(all)
    • Condensed Matter Physics

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