抄録
In this paper, the vacancy migration in Cu interconnect of large scale integration caused by stress induced voiding was calculated using the α multiplication method. Then, the effect of weight coefficient, α, on stress induced vacancy diffusion analysis was investigated and the validity of the α multiplication method was verified. Furthermore, the method of the vacancy diffusion analysis coupled with thermal stress analysis which can consider the history of thermal stress due to temperature changes was proposed. The results of the vacancy diffusion analysis coupled with the thermal stress analysis were compared with the analytical results of the vacancy migration without the effect of history of thermal stress. As a result, the maximum site of vacancy accumulation was found to be qualitatively in good agreement between them. However, the quantitative value of maximum vacancy concentration obtained by the vacancy diffusion analysis coupled with thermal stress analysis was found to be much higher and the vacancy distribution is found to be much more localized.
本文言語 | English |
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ホスト出版物のタイトル | Diffusion in Solids and Liquids VII |
ホスト出版物のサブタイトル | Solids and Liquids, Mass Transfer - Heat Transfer - Microstructure and Properties - Nanodiffusion and Nanostructured Materials |
出版社 | Trans Tech Publications Ltd |
ページ | 632-640 |
ページ数 | 9 |
巻 | 326-328 |
ISBN(印刷版) | 9783037854006 |
DOI | |
出版ステータス | Published - 2012 |
イベント | 7th International Conference on Diffusion in Solids and Liquids, Mass Transfer - Heat Transfer - Microstructure and Properties - Nanodiffusion and Nanostructured Materials, DSL 2011 - Algarve, Portugal 継続期間: 2011 6 26 → 2011 6 30 |
Other
Other | 7th International Conference on Diffusion in Solids and Liquids, Mass Transfer - Heat Transfer - Microstructure and Properties - Nanodiffusion and Nanostructured Materials, DSL 2011 |
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Country | Portugal |
City | Algarve |
Period | 11/6/26 → 11/6/30 |
ASJC Scopus subject areas
- Radiation
- Materials Science(all)
- Condensed Matter Physics