Analysis of on-chip digital noise coupling path for wireless communication IC test chip

Satoshi Tanaka, Peng Fan, Jingyan Ma, Hanae Aoki, Masahiro Yamaguchi, Makoto Nagata, Sho Muroga

研究成果: Conference contribution

1 被引用数 (Scopus)

抄録

In-band spurious tones of a LTE-class radio frequency integrated circuit (RFIC) receiver test element group (TEG) chip was studied in order to evaluate the degree of noise suppression by means of soft magnetic thin film. A 2-μm-thick crossed anisotropy multilayered Co-Zr-Nb film was applied onto the passivation layer of TEG chip. The in-band spurious was suppressed by 10 dB while it had no influence upon wanted signal. A magnetic near field map measured in the 2.1 GHz range indicated several noise coupling paths on chip, which were compared with the chip layout design to estimate victim wires. EM simulation model in connection with circuit simulation is carefully constructed. RF control wirings were most responsible wires than other wires and air couplings. EM simulation predicted the magnetic film should suppress noise by the maximum of 33 dB while it was 10 dB experimentally because of Si substrate coupling and board coupling.

本文言語English
ホスト出版物のタイトルEMC Compo 2015 - 2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits
出版社Institute of Electrical and Electronics Engineers Inc.
ページ216-221
ページ数6
ISBN(電子版)9781467378963
DOI
出版ステータスPublished - 2015 12 15
イベント10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits, EMC Compo 2015 - Edinburgh, United Kingdom
継続期間: 2015 11 102015 11 13

出版物シリーズ

名前EMC Compo 2015 - 2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits

Other

Other10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits, EMC Compo 2015
国/地域United Kingdom
CityEdinburgh
Period15/11/1015/11/13

ASJC Scopus subject areas

  • 電子工学および電気工学
  • 放射線

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