Analysis of intra-chip degital noise coupling path in fully LTE compliant RF receiver test chip

Masahiro Yamaguchi, Peng Fan, Satoshi Tanaka, Sho Muroga, Makoto Nagata

研究成果: Conference contribution

3 被引用数 (Scopus)

抄録

Intra-electromagnetic noise coupling paths from RF-digital to RF receiver front end can be either of air, wire conduction, Si substrate or package/board. In this paper air and wire conduction coupling paths analysis is discussed. A miniature magnetic near field probe is applied to scan over the test chip to map magnetic near field at LTE band 1(2.1 GHz range). The map is reviewed to extract those on-chip wires that may transfer noise from digital to RF circuits. The extracted wire traces are compared with CAD drawings to build up the FEM simulation model. Each wire is terminated by particular impedance obtained by circuit simulation. The analysis clarified that the magnetic film suppressed conduction noise in on-chip control wires. Simulated total suppression of 11.5 dB well explains the measured suppression of 10 dB.

本文言語English
ホスト出版物のタイトル2015 IEEE International Symposium on Electromagnetic Compatibility, EMC 2015
出版社Institute of Electrical and Electronics Engineers Inc.
ページ1007-1011
ページ数5
ISBN(電子版)9781479966158
DOI
出版ステータスPublished - 2015 9 10
イベントIEEE International Symposium on Electromagnetic Compatibility, EMC 2015 - Dresden, Germany
継続期間: 2015 8 162015 8 22

出版物シリーズ

名前IEEE International Symposium on Electromagnetic Compatibility
2015-Septmber
ISSN(印刷版)1077-4076
ISSN(電子版)2158-1118

Other

OtherIEEE International Symposium on Electromagnetic Compatibility, EMC 2015
CountryGermany
CityDresden
Period15/8/1615/8/22

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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