Advanced transmission electron microscopy on silver-based conductive adhesive

Naoyuki Kawamoto, Yasukazu Murakami, Daisuke Shindo, Keunsoo Kim, Katsuaki Suganuma

研究成果: Article査読

6 被引用数 (Scopus)

抄録

Microstructure of a recently developed silver-based conductive adhesive, which is expected as a substitute for conventional soldering, has been studied by advanced transmission electron microscopy (TEM). Energy-filtered TEM has revealed the feature of dispersion of silver particles. Conductivity between neighbored particles is evaluated inside the electron microscope by using two microprobes that can be operated independently. The results shed light on the development of the silver-based conductive adhesive.

本文言語English
ページ(範囲)384-388
ページ数5
ジャーナルNippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
70
4
DOI
出版ステータスPublished - 2006 4

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Mechanics of Materials
  • Metals and Alloys
  • Materials Chemistry

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