Advanced damage-free neutral beam etching technology to texture Si wafer with honeycomb pattern for broadband light trapping in photovoltaics

Halubai Sekhar, Tetsuo Fukuda, Tomohiro Kubota, Mohammad Maksudur Rahman, Hidetaka Takato, Michio Kondo, Seiji Samukawa

研究成果: Article査読

抄録

We introduce a new innovative damage-free neutral beam etching (NBE) technique to transfer a honeycomb resist pattern to silicon (Si) wafer (thickness of 180 µm). Front-surface texturing of Si helps to reduce surface reflection and increase light absorption for solar cell applications. NBE was performed with Cl2 and Cl2/ SF6 gases chemistries, and the influence of the etching time on the etching profiles, surface reflection and potential short-circuit densities (p-JSC) was studied. The Si etching rate with pure Cl2 was ~ 5 nm/min and resulted in anisotropic etch profiles and a minimum surface reflection of 15% at 1000 nm, which is too high for practical use. With the introduction of 5% of SF6, the etching rate increased to 30 nm/min, the etching became isotropic (anisotropy of ~ 1), and sloped sidewalls appeared. NBE with Cl2 (95%)/SF6 (5%) produced a sample with an average surface reflection of 3.7% over the wavelength range 300–1000 nm without any antireflection coating. The minimum surface reflection in this case was ~ 1% at 1030 nm and p-JSC was 40.63 mA/cm2. This type of surface pattern is well suited for low-consumption-material (thin), high-efficiency Si solar cells.

本文言語English
ページ(範囲)27449-27461
ページ数13
ジャーナルJournal of Materials Science: Materials in Electronics
32
23
DOI
出版ステータスPublished - 2021 12

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 原子分子物理学および光学
  • 凝縮系物理学
  • 電子工学および電気工学

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