Advanced 2.5D/3D hetero-integration technologies at GINTI, Tohoku University

K. W. Lee, J. C. Bea, M. Koyanagi, T. Fukushima, T. Tanaka

研究成果: Conference contribution

抄録

The Global Integration Initiative (GINTI) is 8/12-inch R&D foundry fab for the research and development of new 2.5D/3D integration technologies and creative applications. GINTI offers a broad range of services to meet the mounting R&D needs of the semiconductor industry and related industries. GINTI provides a cost-competitive process development infrastructure in a manufacturing-like fab environment and a low-cost, short TAT prototyping of proof of concepts using commercial/customized 2D chip/wafer, and a base-line process set-up for the pilot production of creative 3D systems. GINTI aims to provide Tohoku University's advanced 2.5D/3D integration technologies into electronic industries to accelerate the commercialization of innovative 3D technologies and applications into real, manufacturing-ready technology solutions with FAST. This paper introduces advanced 2.5D/3D hetero-integration technologies developed by GINTI/Tohoku University.

本文言語English
ホスト出版物のタイトル2015 International 3D Systems Integration Conference, 3DIC 2015
出版社Institute of Electrical and Electronics Engineers Inc.
ページFS2.1-FS2.5
ISBN(電子版)9781467393850
DOI
出版ステータスPublished - 2015 11月 20
イベントInternational 3D Systems Integration Conference, 3DIC 2015 - Sendai, Japan
継続期間: 2015 8月 312015 9月 2

出版物シリーズ

名前2015 International 3D Systems Integration Conference, 3DIC 2015

Other

OtherInternational 3D Systems Integration Conference, 3DIC 2015
国/地域Japan
CitySendai
Period15/8/3115/9/2

ASJC Scopus subject areas

  • 電子工学および電気工学

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