A thermomechanical relay with microspring contact array

Y. Liu, X. Li, T. Abe, Y. Haga, M. Esashi

研究成果: Paper

33 被引用数 (Scopus)

抄録

A micromachined thermomechanical relay with Au microspring contact array is presented. Thermally excited Al-SiO2 bimorph cantilevers have been fabricated with micromachining technology. Sputtered Au/Pt/Ti contacts are formed on the tip of the cantilevers and microheaters are built in the cantilevers. In order to reduce the ON-resistance and to avoid the metallic binding between Au contacts, Au microspring contact array is fabricated on Pyrex glass. The fabricated thermomechanical microrelay is operated with input power levels ranging from 20-80 mW at frequencies up to 3 KHz. The ON resistance RON, that includes contact resistance and signal line resistance is in the range of 200-500 mΩ and switching time is about 300 μsec. 107 cycles operation has been performed keeping the RON around 300 mΩ.

元の言語English
ページ220-223
ページ数4
出版物ステータスPublished - 2001 1 1
イベント14th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2001) - Interlaken, Switzerland
継続期間: 2001 1 212001 1 25

Other

Other14th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2001)
Switzerland
Interlaken
期間01/1/2101/1/25

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Mechanical Engineering
  • Electrical and Electronic Engineering

フィンガープリント 「A thermomechanical relay with microspring contact array」の研究トピックを掘り下げます。これらがまとまってユニークなフィンガープリントを構成します。

引用スタイル